D-band waveguide diplexer fabricated using micro laser sintering

Yang Yu; Yi Wang; Talal Skaik; Thomas Starke; Xiaobang Shang; Michael J. Lancaster; Peter Hunyor; Peter Huggard; Hui Wang; Michael Harris; Mat Beardsley; Qingsha S. Cheng

doi:10.1109/TCPMT.2022.3204887

D-band waveguide diplexer fabricated using micro laser sintering

Yang Yu, Yi Wang^*, Talal Skaik, Thomas Starke, Xiaobang Shang, Michael J. Lancaster, Peter Hunyor, Peter Huggard, Hui Wang, Michael Harris, Mat Beardsley, Qingsha S. Cheng^*

^*Corresponding author for this work

Research output: Contribution to journal › Article › peer-review

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Abstract

We report a D-band waveguide diplexer, with two passbands of 130 - 134 GHz and 151.5 - 155.5 GHz, fabricated using micro laser sintering (MLS) additive manufacturing with stainless-steel. This is the first demonstration of metal 3D printing technology for multi-port filtering device at a sub-THz frequency. For comparison, the same diplexer design has also been implemented using computer numerical controlled (CNC) milling. The diplexer, designed using coupling matrix theory, employs an all-resonator and E-plane split-block structure. The two channels are folded for compactness. A staircase coupled structure is used in one channel to increase the isolation performance. The printed waveguide flanges are modified to adapt to the limited printing volume from the MLS. Effects of fabrication tolerance on the diplexer are investigated. An effective and unconventional electroless plating process is developed. The measured average insertion losses of the gold coated diplexer are 1.31 dB and 1.37 dB respectively. Respective frequency shifts from design values are 0.92% and 1.1%, and bandwidth variations are 4% and 15%. From a comprehensive treatment of the end-to-end manufacture process, the work demonstrates MLS to be a promising fabrication technique for complex waveguide devices at sub-THz frequency range.

Original language	English
Pages (from-to)	1446 - 1457
Number of pages	12
Journal	IEEE Transactions on Components, Packaging and Manufacturing Technology
Volume	12
Issue number	9
DOIs	https://doi.org/10.1109/TCPMT.2022.3204887
Publication status	Published - 6 Sept 2022

Bibliographical note

Publisher Copyright:
IEEE

Keywords

Additive manufacturing
Bandwidth
CNC machining
Couplings
Laser sintering
Passband
Three-dimensional printing
Transmission line matrix methods
Waveguide lasers
all-resonator structure
micro laser sintering
surface treatment
waveguide diplexer

ASJC Scopus subject areas

Electronic, Optical and Magnetic Materials
Industrial and Manufacturing Engineering
Electrical and Electronic Engineering

Access to Document

10.1109/TCPMT.2022.3204887Licence: None: All rights reserved

YuY2022D-band
This is the authors' accepted manuscript (AAM) for Y. Yu et al., "D-Band Waveguide Diplexer Fabricated Using Micro Laser Sintering," in IEEE Transactions on Components, Packaging and Manufacturing Technology, vol. 12, no. 9, pp. 1446-1457, Sept. 2022, doi: 10.1109/TCPMT.2022.3204887, published by IEEE. © 2022 IEEE. Personal use of this material is permitted. Permission from IEEE must be obtained for all other uses, in any current or future media, including reprinting/republishing this material for advertising or promotional purposes, creating new collective works, for resale or redistribution to servers or lists, or reuse of any copyrighted component of this work in other works.
Accepted author manuscript, 1.72 MBLicence: Other (please specify with Rights Statement)

Cite this

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title = "D-band waveguide diplexer fabricated using micro laser sintering",

abstract = "We report a D-band waveguide diplexer, with two passbands of 130 - 134 GHz and 151.5 - 155.5 GHz, fabricated using micro laser sintering (MLS) additive manufacturing with stainless-steel. This is the first demonstration of metal 3D printing technology for multi-port filtering device at a sub-THz frequency. For comparison, the same diplexer design has also been implemented using computer numerical controlled (CNC) milling. The diplexer, designed using coupling matrix theory, employs an all-resonator and E-plane split-block structure. The two channels are folded for compactness. A staircase coupled structure is used in one channel to increase the isolation performance. The printed waveguide flanges are modified to adapt to the limited printing volume from the MLS. Effects of fabrication tolerance on the diplexer are investigated. An effective and unconventional electroless plating process is developed. The measured average insertion losses of the gold coated diplexer are 1.31 dB and 1.37 dB respectively. Respective frequency shifts from design values are 0.92% and 1.1%, and bandwidth variations are 4% and 15%. From a comprehensive treatment of the end-to-end manufacture process, the work demonstrates MLS to be a promising fabrication technique for complex waveguide devices at sub-THz frequency range.",

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AU - Wang, Yi

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AU - Shang, Xiaobang

AU - Lancaster, Michael J.

AU - Hunyor, Peter

AU - Huggard, Peter

AU - Wang, Hui

AU - Harris, Michael

AU - Beardsley, Mat

AU - Cheng, Qingsha S.

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AB - We report a D-band waveguide diplexer, with two passbands of 130 - 134 GHz and 151.5 - 155.5 GHz, fabricated using micro laser sintering (MLS) additive manufacturing with stainless-steel. This is the first demonstration of metal 3D printing technology for multi-port filtering device at a sub-THz frequency. For comparison, the same diplexer design has also been implemented using computer numerical controlled (CNC) milling. The diplexer, designed using coupling matrix theory, employs an all-resonator and E-plane split-block structure. The two channels are folded for compactness. A staircase coupled structure is used in one channel to increase the isolation performance. The printed waveguide flanges are modified to adapt to the limited printing volume from the MLS. Effects of fabrication tolerance on the diplexer are investigated. An effective and unconventional electroless plating process is developed. The measured average insertion losses of the gold coated diplexer are 1.31 dB and 1.37 dB respectively. Respective frequency shifts from design values are 0.92% and 1.1%, and bandwidth variations are 4% and 15%. From a comprehensive treatment of the end-to-end manufacture process, the work demonstrates MLS to be a promising fabrication technique for complex waveguide devices at sub-THz frequency range.

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D-band waveguide diplexer fabricated using micro laser sintering

Abstract

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Keywords

ASJC Scopus subject areas

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